The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2025

Filed:

May. 14, 2021
Applicants:

Beijing Boe Optoelectronics Technology Co., Ltd., Beijing, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Zepeng Sun, Beijing, CN;

Xianglei Qin, Beijing, CN;

Jinshuai Duan, Beijing, CN;

Yong Zhang, Beijing, CN;

Xiaojuan Wu, Beijing, CN;

Limin Zhang, Beijing, CN;

Zhilong Duan, Beijing, CN;

Zhiqiang Yu, Beijing, CN;

Liangzhen Tang, Beijing, CN;

Honggui Jin, Beijing, CN;

Ruomei Bian, Beijing, CN;

Zhaohu Yu, Beijing, CN;

Xing Xu, Beijing, CN;

Wulin Zhang, Beijing, CN;

Xiaofeng Yin, Beijing, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1362 (2006.01); G02F 1/1368 (2006.01);
U.S. Cl.
CPC ...
G02F 1/136286 (2013.01); G02F 1/136209 (2013.01); G02F 1/136227 (2013.01); G02F 1/1368 (2013.01);
Abstract

A display substrate comprises a substrate; a first electrode layer; comprises: multiple first signal lines; the first insulating layer comprises multiple first via holes, orthographic projections of the first via holes on the substrate fall into orthographic projections of the first signal lines on the substrate; a second electrode layer including multiple first connection electrodes; the first connecting electrode is connected with the first signal line through the first via hole; the second insulating layer is on the side, away from the first insulating layer, of the second electrode layer and comprises multiple second via holes; the orthographic projection of the second via hole on the substrate falls into the orthographic projection of the first connecting electrode on the substrate, and the orthographic projection of the second via hole on the substrate and the orthographic projection of the first via hole on the substrate are arranged in a staggered manner.


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