The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2025
Filed:
Jun. 02, 2023
Dongguan Xuntao Electronic Co., Ltd., Dongguan, CN;
Dongguan Luxshare Technologies Co., Ltd, Dongguan, CN;
Chung-Hsin Fu, Taipei, TW;
Min-Sheng Kao, Taipei, TW;
Yi-Tseng Lin, Taipei, TW;
Chih-Wei Yu, Taipei, TW;
DONGGUAN XUNTAO ELECTRONIC CO., LTD., Dongguan, CN;
DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD., Dongguan, CN;
Abstract
Disclosed is an optical emission assembly including a heat dissipation base, an adapter, a light-emitting assembly, a multiplexer, a cooling chip, a converging lens, a housing, and a heat-conducting glue. The heat dissipation base includes a first heat dissipation plate and a second heat dissipation plate forming a T-shaped or an L-shaped structure. The light-emitting assembly and the multiplexer are disposed on the second heat dissipation plate. The multiplexer combines light beams emitted by light-emitting chips of the light-emitting assembly into one light beam, and then the one light beam enters the adapter through the converging lens. The cooling chip is disposed on the first heat dissipation plate. The heat dissipation base and the cooling chip are disposed in the housing, and the cooling chip corresponds to a through hole of the housing. The heat-conducting glue is filled in the through hole and between the cooling chip and the housing.