The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2025

Filed:

Mar. 22, 2022
Applicant:

Daikin Industries, Ltd., Osaka, JP;

Inventors:

Hitoshi Imamura, Osaka, JP;

Eri Mukai, Osaka, JP;

Hiroyuki Hamada, Osaka, JP;

Yuuki Kuwajima, Osaka, JP;

Manabu Fujisawa, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); B29K 27/12 (2006.01); B29L 23/00 (2006.01); C08F 214/26 (2006.01); C08L 27/18 (2006.01); F16L 47/02 (2006.01); B29K 27/18 (2006.01);
U.S. Cl.
CPC ...
F16L 47/02 (2013.01); B29C 66/1142 (2013.01); B29C 66/5221 (2013.01); B29C 66/5229 (2013.01); B29C 66/73921 (2013.01); C08L 27/18 (2013.01); B29K 2027/12 (2013.01); B29K 2027/18 (2013.01); B29L 2023/22 (2013.01); C08F 214/262 (2013.01);
Abstract

The present disclosure provides a welded body having a connecting structure formed by welding a first molded body and a second molded body, wherein the first and second molded bodies contain at least one copolymer selected from the group consisting of a tetrafluoroethylene/fluoro (alkyl vinyl ether) copolymer and a tetrafluoroethylene/hexafluoropropylene copolymer, and wherein the connecting structure has a liquid contact surface to be in contact with a liquid having a solubility parameter of 14 to 35 (MPa), a welded part formed in the connecting structure is not exposed to the liquid contact surface, and the number of particles of 30 nm or larger to be eluted from the liquid contact surface in the connecting structure is 1,000 particles/ml or less.


Find Patent Forward Citations

Loading…