The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2025

Filed:

Feb. 16, 2024
Applicant:

Sumco Corporation, Tokyo, JP;

Inventors:

Ken Kitahara, Akita, JP;

Masanori Fukui, Akita, JP;

Hiroshi Kishi, Akita, JP;

Tomokazu Katano, Tokyo, JP;

Eriko Kitahara, Akita, JP;

Assignee:

SUMCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 15/10 (2006.01); C03B 20/00 (2006.01); C03C 19/00 (2006.01); C30B 29/06 (2006.01); F27B 14/10 (2006.01); G01N 21/3563 (2014.01); G01N 33/38 (2006.01); C03B 19/09 (2006.01);
U.S. Cl.
CPC ...
C30B 15/10 (2013.01); C03B 20/00 (2013.01); C03C 19/00 (2013.01); C30B 29/06 (2013.01); F27B 14/10 (2013.01); G01N 21/3563 (2013.01); G01N 33/386 (2013.01); C03B 19/095 (2013.01);
Abstract

An infrared transmissivity measurement method is for measuring an infrared transmissivity of a quartz glass crucible which includes a transparent layer made of quartz glass that does not contain bubbles, a bubble layer formed outside the transparent layer and made of quartz glass containing bubbles, and a semi-molten layer formed outside the bubble layer and made of raw material silica powder solidified in a semi-molten state. The infrared transmissivity measurement method includes processing an outer surface of the quartz glass crucible formed by the semi-molten layer to lower a surface roughness of the outer surface; and measuring an infrared transmissivity of the quartz glass crucible based on infrared light passing through the outer surface after processing the outer surface.


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