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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12391856 B1

PDFFull Text
Date of Patent:
Aug. 19, 2025

Filed:

Sep. 25, 2017

Adhesive composition

Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

So Young Kim, Daejeon, KR;

Seung Min Lee, Daejeon, KR;

Se Woo Yang, Daejeon, KR;

Hyun Sup Lee, Daejeon, KR;

Yeon Soo Kim, Daejeon, KR;

Assignee:

LG Chem, Ltd., Seoul, KR;

Attorney:

Bryan Cave Leighton Paisner LLP

Primary Examiner:

Samir Shah

Int. Cl.
CPC ...
C09J 175/16 (2006.01); C08K 3/013 (2018.01); C08K 3/22 (2006.01); C08K 3/36 (2006.01); C08K 5/00 (2006.01); C08K 5/1515 (2006.01); C09J 123/22 (2006.01); C09J 123/26 (2006.01); C09J 133/08 (2006.01); C09J 147/00 (2006.01); C09J 163/00 (2006.01); C09J 175/04 (2006.01); H10K 50/844 (2023.01);
U.S. Cl.
CPC ...
C09J 175/16 (2013.01); C08K 3/013 (2018.01); C08K 3/22 (2013.01); C08K 3/36 (2013.01); C08K 5/0025 (2013.01); C08K 5/1515 (2013.01); C09J 123/22 (2013.01); C09J 123/26 (2013.01); C09J 133/08 (2013.01); C09J 147/00 (2013.01); C09J 163/00 (2013.01); C09J 175/04 (2013.01); C08K 2003/2206 (2013.01); C08K 2201/005 (2013.01); C08K 2201/006 (2013.01); C09J 2203/326 (2013.01); C09J 2423/00 (2013.01); C09J 2433/00 (2013.01); C09J 2463/00 (2013.01); H10K 50/844 (2023.02);
Abstract

The present invention relates to an adhesive composition and an organic electronic device comprising the same, and provides an adhesive composition which can form a encapsulating structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifetime of the organic electronic device, and can improve processability by being easily applied in the process of forming the encapsulating structure of the organic electronic device, thereby preventing problems that air bubbles flow into the inside of the encapsulating structure or application nozzles are clogged, and an organic electronic device comprising the same.

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