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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12391850 B1

PDFFull Text
Date of Patent:
Aug. 19, 2025

Filed:

Dec. 09, 2021

Dielectric substrate and method of forming the same

Applicant:

Versiv Composites Limited, Kilrush, IE;

Inventors:

Jennifer Adamchuk, Marlborough, MA (US);

Dale Thomas, Rochdale, GB;

Meghann White, Bedford, NH (US);

Sethumadhavan Ravichandran, Shrewsbury, MA (US);

Gerard T. Buss, Bedford, NH (US);

Assignee:

VERSIV COMPOSITES LIMITED, Kilrush, IE;

Attorney:

CANTOR COLBURN LLP

Primary Examiner:

Ian A Rummel

Int. Cl.
CPC ...
C09J 7/29 (2018.01); B32B 7/12 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); B32B 27/28 (2006.01); C09J 5/00 (2006.01); C09J 7/38 (2018.01); C09J 11/04 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
C09J 7/29 (2018.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 27/281 (2013.01); C09J 5/00 (2013.01); C09J 7/381 (2018.01); C09J 11/04 (2013.01); H05K 1/0373 (2013.01); H05K 1/09 (2013.01); H05K 3/4644 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2264/1021 (2020.08); B32B 2307/204 (2013.01); B32B 2307/732 (2013.01); B32B 2457/08 (2013.01); C09J 2203/326 (2013.01); C09J 2301/41 (2020.08); C09J 2400/166 (2013.01); C09J 2427/00 (2013.01); C09J 2427/006 (2013.01); C09J 2479/086 (2013.01); H05K 2201/015 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0209 (2013.01);
Abstract

The present disclosure relates to a dielectric substrate that may include a first fluoropolymer based adhesive layer, a polyimide layer overlying the fluoropolymer based adhesive layer, and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.

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