The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2025
Filed:
Jan. 30, 2019
Applicant:
Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);
Inventors:
Peter Klaerner, Corona, CA (US);
Jose De Jesus Lozano De Alva, Lake Forest, CA (US);
Jason Fu, Long Beach, CA (US);
Masih Mahmoodi, Irvine, CA (US);
Assignee:
Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 1/12 (2024.01); B08B 1/20 (2024.01); B08B 1/34 (2024.01); B08B 3/02 (2006.01); B08B 7/00 (2006.01); B23K 37/00 (2025.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B08B 1/12 (2024.01); B08B 1/20 (2024.01); B08B 1/34 (2024.01); B08B 3/02 (2013.01); B08B 7/0028 (2013.01); B08B 7/0035 (2013.01); B08B 7/0042 (2013.01); B23K 37/00 (2013.01); H01L 24/78 (2013.01); H01L 2224/7801 (2013.01); H01L 2224/78343 (2013.01); H01L 2224/78621 (2013.01); H01L 2224/78756 (2013.01);
Abstract
A method of cleaning a tip of a wire bonding tool on a wire bonding machine is provided. The method includes the steps of: (a) moving a wire away from the wire bonding tool such that the tip of the wire bonding tool is accessible to a cleaning station of the wire bonding machine; and (b) cleaning at least a portion of the tip of the wire bonding tool with the cleaning station after step (a).