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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12389677 B1

PDFFull Text
Date of Patent:
Aug. 12, 2025

Filed:

Dec. 22, 2023

Light-emitting device and method for manufacturing the same

Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi, JP;

Inventor:

Akihiro Chida, Isehara, JP;

Assignee:

Semiconductor Energy Laboratory Co., Ltd., Atsugi, JP;

Attorneys:

Eric J. Robinson

Robinson Intellectual Property Law Office, P.C.

Primary Examiner:

Michael M Trinh

Int. Cl.
CPC ...
H10D 86/01 (2025.01); H10D 86/40 (2025.01); H10D 86/60 (2025.01); H10H 20/01 (2025.01); H10H 20/819 (2025.01); H10H 20/85 (2025.01); H10H 20/857 (2025.01); H10K 50/805 (2023.01); H10K 59/131 (2023.01); H10K 71/00 (2023.01); H10K 71/50 (2023.01); H10K 71/80 (2023.01); H10K 77/10 (2023.01); H10K 59/12 (2023.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
H10D 86/0214 (2025.01); H10D 86/40 (2025.01); H10D 86/60 (2025.01); H10H 20/01 (2025.01); H10H 20/819 (2025.01); H10H 20/8506 (2025.01); H10H 20/857 (2025.01); H10K 50/805 (2023.02); H10K 59/131 (2023.02); H10K 71/00 (2023.02); H10K 71/50 (2023.02); H10K 71/80 (2023.02); H10K 77/111 (2023.02); H01L 2224/4847 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/12044 (2013.01); H10H 20/036 (2025.01); H10H 20/0364 (2025.01); H10K 59/1201 (2023.02); H10K 2102/311 (2023.02);
Abstract

A highly reliable light-emitting device and a manufacturing method thereof are provided. A light-emitting element and a terminal electrode are formed over an element formation substrate; a first substrate having an opening is formed over the light-emitting element and the terminal electrode with a bonding layer provided therebetween; an embedded layer is formed in the opening; a transfer substrate is formed over the first substrate and the embedded layer; the element formation substrate is separated; a second substrate is formed under the light-emitting element and the terminal electrode; and the transfer substrate and the embedded layer are removed. In addition, an anisotropic conductive connection layer is formed in the opening, and an electrode is formed over the anisotropic conductive connection layer. The terminal electrode and the electrode are electrically connected to each other through the anisotropic conductive connection layer.

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