The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 12, 2025

Filed:

Apr. 17, 2023
Applicant:

Sungrow (Shanghai) Co., Ltd., Shanghai, CN;

Inventors:

Bing Zeng, Shanghai, CN;

Haiyang Yu, Shanghai, CN;

Ru Wang, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H02M 7/00 (2006.01); H05K 1/18 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H05K 7/209 (2013.01); H02M 7/003 (2013.01); H05K 1/181 (2013.01); H05K 7/1427 (2013.01); H05K 7/2049 (2013.01); H05K 7/20454 (2013.01); H05K 7/20472 (2013.01); H05K 7/20936 (2013.01);
Abstract

The present application relates to the technical field of semiconductor, and in particular to an inverter. The inverter provided by the present application includes a substrate, a discrete device and a heat conducting component. The discrete device and the heat conducting component are both arranged on the substrate. A part of the heat conducting component is located in an area of the substrate where the discrete device is provided, and another part of the heat conducting component is located in an area of the substrate where the discrete device is not provided. The heat conducting component may rapidly transfer the heat of the overheated area of the substrate where the discrete device is mounted to the less hot area of the substrate, and promote the heat generated by the discrete device to spread evenly to the substrate.


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