The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2025
Filed:
Jul. 19, 2023
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Jung Soo Kim, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A printed circuit board includes an insulating layer; an interconnection layer disposed on the insulating layer, and including a plurality of metal pads for mounting a semiconductor chip thereon; and a solder resist layer disposed on the insulating layer and covering the interconnection layer, the solder resist layer having a plurality of openings respectively exposing at least a portion of at least one of the plurality of metal pads. A rectangular region created by substantially connecting outer edges of outermost openings among the plurality of openings in a straight line is substantially equally divided into a plurality of cells, and a ratio of areas of the metal pads disposed in each cell to an area of each cell is calculated, and when a maximum value thereof is Pand a minimum value thereof is P, (P−P)*100≤20.