The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 12, 2025

Filed:

Feb. 03, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Kwanghyun Baek, Suwon-si, KR;

Youngsub Kim, Suwon-si, KR;

Jinhoon Kim, Suwon-si, KR;

Chunmyung Park, Suwon-si, KR;

Youngju Lee, Suwon-si, KR;

Juneseok Lee, Suwon-si, KR;

Wangi Cha, Suwon-si, KR;

Dohyuk Ha, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/24 (2006.01); H01Q 5/42 (2015.01); H01Q 9/04 (2006.01); H01Q 21/00 (2006.01); H01Q 21/06 (2006.01); H05K 1/14 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/141 (2013.01); H01Q 1/246 (2013.01); H01Q 5/42 (2015.01); H01Q 9/0414 (2013.01); H01Q 21/0025 (2013.01); H01Q 21/065 (2013.01); H05K 1/0237 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10734 (2013.01);
Abstract

An electronic device is provided. The electronic device includes multiple antenna arrays, multiple first printed circuit board (PCB) sets corresponding to the multiple antenna arrays, a second PCB including a power interface, and a grid array configured to couple a first surface of each of first PCBs of the first PCB sets corresponding to an antenna array and a first surface of the second PCB, wherein the size of the first PCB is smaller than that of the second PCB, and a feeding line configured to transfer a signal to an antenna element is formed on at least one of a layer corresponding to the first surface of each of the first PCBs or a layer corresponding to the first surface of the second PCB.


Find Patent Forward Citations

Loading…