The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2025
Filed:
Aug. 07, 2023
Applicant:
Ciena Corporation, Hanover, MD (US);
Inventors:
Daniel Rivaud, Ottawa, CA;
Fabien Colton, Kars, CA;
Luc Lacourciere, Stittsville, CA;
Lloyd Cosman, Stittsville, CA;
Assignee:
Ciena Corporation, Hanover, MD (US);
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0213 (2013.01); H05K 1/0271 (2013.01); H05K 2201/10272 (2013.01);
Abstract
A circuit assembly includes a printed circuit board, an integrated circuit chip coupled to the printed circuit board, and a plurality of power phases associated with the integrated circuit chip arranged as grouped power phases. One or more power phases of the grouped power phases is physically distanced from a side of the integrated circuit chip associated with physically distanced power phase(s) of the grouped power phases.