The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2025
Filed:
Nov. 08, 2022
Applicant:
Stmicroelectronics (Grenoble 2) Sas, Grenoble, FR;
Inventor:
Romain Coffy, Voiron, FR;
Assignee:
STMicroelectronics (Grenoble 2) SAS, Grenoble, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 1/02 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0212 (2013.01); H05K 1/144 (2013.01); H05K 2201/06 (2013.01);
Abstract
An electronic circuit includes an upper substrate and a lower substrate. An electronic integrated circuit chip is positioned between the upper and lower substrates. The chip includes contact elements coupled to the upper substrate. A first region made of a first material is arranged between the chip and a heat transfer area crossing the lower substrate. A second region filled with a second material couples the lower and upper substrates and laterally surrounds the first region. The first material has a thermal conductivity greater than a thermal conductivity of the second material.