The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2025
Filed:
Jan. 25, 2022
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventor:
Won Seob Shin, Seoul, KR;
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 23/52 (2023.01); H04N 23/54 (2023.01); H04N 25/77 (2023.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H04N 23/52 (2023.01); H04N 23/54 (2023.01); H04N 25/77 (2023.01); H05K 1/0271 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10287 (2013.01);
Abstract
A camera module according to an embodiment includes a reinforcing plate; a bump part disposed on the reinforcing plate; a substrate disposed on the reinforcing plate and including a cavity vertically overlapping the bump part; and an image sensor disposed on the bump part, wherein the bump part includes a first bump disposed on the reinforcing plate and having a first height; and a second bump disposed on the first bump and having a second height different from the first height; and wherein an upper surface of the second bump is in direct contact with a lower surface of the image sensor.