The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 12, 2025

Filed:

Apr. 28, 2022
Applicant:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Inventors:

Dongjin Jung, Gyeonggi-do, KR;

Chanju Park, Gyeonggi-do, KR;

Jungi Jeong, Gyeonggi-do, KR;

Taeksun Kwon, Gyeonggi-do, KR;

Jungwoo Seo, Gyeonggi-do, KR;

Junhwa Oh, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 21/00 (2006.01); H01Q 1/24 (2006.01); H01Q 1/38 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/243 (2013.01); H01Q 1/38 (2013.01); H01Q 21/0075 (2013.01);
Abstract

An antenna module, according to various embodiments, may comprise: a first layer including a first etching region, a first via pad disposed to be spaced apart from an edge of the first etching region, and a first via hole disposed on one surface of the first via pad; and a second layer stacked on one surface of the first layer, and including a second etching region, a plurality of second via pads disposed to be spaced apart from an edge of the second etching region, a plurality of second via holes disposed on one surface of the plurality of second via pads, and a plurality of second dividing lines electrically connecting the plurality of second via pads.


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