The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 12, 2025

Filed:

Jul. 29, 2022
Applicant:

Panelsemi Corporation, New Taipei, TW;

Inventor:

Chin-Tang Li, New Taipei, TW;

Assignee:

PANELSEMI CORPORATION, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H10D 86/40 (2025.01); H10D 86/60 (2025.01); H10H 20/857 (2025.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H10D 86/441 (2025.01); H10D 86/60 (2025.01); H10H 20/857 (2025.01);
Abstract

An electronic device includes a first substrate, multiple unit tiles, multiple electrical components, multiple holes, and multiple conductors. The first substrate includes a first patterned trace, multiple driving members electrically connected with the first patterned trace, and multiple pads electrically connected with the first patterned trace and respectively corresponding with the driving members. Each of the unit tiles defines a second face and a first face opposing to each other, the electrical components are disposed on the second faces of the unit tiles, and the conductors are exposed from the first faces of the unit tiles and respectively corresponding with the electrical components. The conductors are arranged in the holes respectively and overlapping the pads of the first substrate respectively for electrically connecting the electrical components to the pads of the first substrate, wherein the conductors are underneath the second faces of the unit tiles.


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