The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2025
Filed:
Jun. 20, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Sungeun Jo, Hwaseong-si, KR;
Youngdeuk Kim, Hwaseong-si, KR;
Jaechoon Kim, Incheon, KR;
Taehwan Kim, Hwaseong-si, KR;
Kyungsuk Oh, Seongnam-si, KR;
Abstract
A semiconductor package includes a first semiconductor chip, a second semiconductor chip stacked on the first semiconductor chip, and a plurality of third semiconductor chips sequentially stacked on the second semiconductor chip, in which a horizontal width of each of the first semiconductor chip and the second semiconductor chip is greater than a horizontal width of each of the plurality of third semiconductor chips, and the first semiconductor chip and the second semiconductor chip are connected to each other through direct contact of a bonding pad.