The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 12, 2025

Filed:

Dec. 03, 2024
Applicant:

Auradine, Inc., Santa Clara, CA (US);

Inventors:

Anuya Reddy, Pleasanton, CA (US);

Lyle Looney, Livermore, CA (US);

Pranav Kalyanraman, Santa Clara, CA (US);

Larry Yu, Santa Clara, CA (US);

Assignee:

Auradine, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/427 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/427 (2013.01); H01L 24/32 (2013.01); H01L 25/0655 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/2064 (2013.01);
Abstract

Examples of devices for providing cooling solutions are described. One example device includes a substrate, one or more integrated circuit (IC) chips placed on the substrate, and a boilerplate including one or more rails. At least one rail of the one or more rails includes a recess in a surface of the at least one rail that faces the one or more IC chips. The recess includes outer walls contacting the one or more IC chips and forming a cavity for accommodating a thermal interface material (TIM) coupled to the one or more IC chips.


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