The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2025
Filed:
Jan. 26, 2022
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Akil Khamisi Sutton, Poughkeepsie, NY (US);
Peter A. Smith, Wappingers Falls, NY (US);
John Greg Massey, Jericho, VT (US);
William Edward Ansley, Round Rock, TX (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76886 (2013.01); H01L 23/528 (2013.01);
Abstract
Embodiments are for using adaptive fill techniques to avoid electromigration, thereby resulting in electromigration signoff. A wire segment failing to meet an electromigration current limit is determined on an integrated circuit (IC). Fill shapes are connected adjacent to the wire segment to cause the wire segment to meet the electromigration current limit. The fill shapes are non-functional shapes on the IC.