The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2025
Filed:
Jun. 02, 2023
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Ji Hyeon Lee, Suwon-si, KR;
Jong Ho Lee, Suwon-si, KR;
Eun Jung Lee, Suwon-si, KR;
Yong Min Hong, Suwon-si, KR;
Yong Park, Suwon-si, KR;
Min Woo Kim, Suwon-si, KR;
Jung Tae Park, Suwon-si, KR;
Sun Mi Kim, Suwon-si, KR;
Sim Chung Kang, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A method of manufacturing a multilayer electronic component, the method includes, attaching a margin portion green sheet including a ceramic material, a photocuring agent, and a photoinitiator to at least one end surface of each of the plurality of cut ceramic green sheet stacked bodies in the third direction, an energy irradiation operation of irradiating, with energy, the margin portion green sheet to generate a photocuring polymerization reaction between the photocuring agent and the photoinitiator.