The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 12, 2025

Filed:

Jul. 21, 2023
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Sin Il Gu, Suwon-si, KR;

Jin Hyung Lim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/012 (2006.01); H01G 4/008 (2006.01); H01G 4/224 (2006.01); H01G 4/232 (2006.01); H01G 4/248 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H01G 4/012 (2013.01); H01G 4/008 (2013.01); H01G 4/224 (2013.01); H01G 4/232 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01);
Abstract

A multilayer electronic component includes a body including first and second surfaces facing each other in a first direction, and third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and including a capacitance forming portion including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, a lower cover portion disposed between the first surface and the capacitance forming portion, and an upper cover portion disposed between the second surface and the capacitance forming portion, a first external electrode disposed on the third surface, and a second external electrode disposed on the fourth surface, wherein, among the upper cover portion and the lower cover portion, only the upper cover portion includes a buffer electrode.


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