The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 12, 2025

Filed:

Nov. 09, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Kyung Chin Yi, Suwon-si, KR;

Dong Sik Jeong, Suwon-si, KR;

Sun Ho Kim, Suwon-si, KR;

Woo-Hyung Kim, Suwon-si, KR;

Seung Uk Park, Suwon-si, KR;

Yong Hee Lee, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70916 (2013.01); G03F 7/70725 (2013.01); G03F 7/70808 (2013.01); G03F 7/7095 (2013.01); G03F 7/70991 (2013.01);
Abstract

Provided is a lithography apparatus including a wafer stage, a cable connected to the wafer stage, the cable being configured to bend based on the wafer stage moving, a support unit configured to prevent the cable from sagging, the support unit including a plurality of clamps configured to restrict movement of the cable and a connection member connecting the plurality of clamps to each other, and a protective unit under the cable, the protective unit being configured to collide with the support unit based on the wafer stage moving, wherein the protective unit includes ultra-high molecular weight polyethylene (UHMWPE).


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