The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 12, 2025

Filed:

Aug. 25, 2022
Applicant:

Geminatio, Inc., Schenectady, NY (US);

Inventors:

Brennan Peterson, Longmont, CO (US);

Phillip D. Hustad, Longmont, CO (US);

Assignee:

Geminatio, Inc., Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/09 (2006.01); G03F 7/004 (2006.01); G03F 7/039 (2006.01); G03F 7/32 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/094 (2013.01); G03F 7/0045 (2013.01); G03F 7/0048 (2013.01); G03F 7/039 (2013.01); G03F 7/327 (2013.01); H01L 24/19 (2013.01); H01L 2224/19 (2013.01);
Abstract

A method of microfabrication includes forming a first relief pattern on a target layer of a substrate, coating the first relief pattern with a first solubility-shifting agent, layering a first polymeric fill on the first relief pattern, and diffusing the first solubility-shifting agent into the first polymeric fill to provide a solubility-shifted region of the first polymeric fill. Then the method includes forming a second relief pattern over the first relief pattern, coating the second relief pattern with a second solubility-shifting agent, layering a second polymeric fill on the second relief pattern, and diffusing the second solubility-shifting into the second polymeric fill to provide a solubility-shifted region of the second polymeric fill. Finally, the solubility-shifted regions of the first polymeric fill and the second polymeric fill are developed and the target layer is etched.


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