The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2025
Filed:
Apr. 28, 2022
Applicant:
Hamilton Sundstrand Corporation, Charlotte, NC (US);
Inventors:
Viktor Kilchyk, Lancaster, NY (US);
Brent J. Merritt, Southwick, MA (US);
Assignee:
Hamilton Sundstrand Corporation, Charlotte, NC (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 7/02 (2006.01); B22F 3/11 (2006.01); B22F 5/00 (2006.01); B22F 10/28 (2021.01); B22F 10/32 (2021.01); B33Y 10/00 (2015.01); B33Y 40/20 (2020.01); B33Y 50/02 (2015.01); B33Y 80/00 (2015.01); B64D 13/08 (2006.01); F01D 11/00 (2006.01); F01D 25/24 (2006.01); F04D 29/02 (2006.01); F04D 29/08 (2006.01); F04D 29/28 (2006.01); F04D 29/42 (2006.01); F16J 15/06 (2006.01); F16J 15/08 (2006.01); F16J 15/10 (2006.01); F25B 9/00 (2006.01); F25B 9/06 (2006.01); B64D 13/06 (2006.01);
U.S. Cl.
CPC ...
F28F 7/02 (2013.01); B22F 3/1115 (2013.01); B22F 5/009 (2013.01); B22F 10/28 (2021.01); B22F 10/32 (2021.01); B33Y 10/00 (2014.12); B33Y 40/20 (2020.01); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12); B64D 13/08 (2013.01); F01D 11/00 (2013.01); F01D 25/24 (2013.01); F04D 29/023 (2013.01); F04D 29/083 (2013.01); F04D 29/285 (2013.01); F04D 29/4206 (2013.01); F16J 15/065 (2013.01); F16J 15/08 (2013.01); F16J 15/104 (2013.01); F25B 9/004 (2013.01); F25B 9/06 (2013.01); B64D 13/06 (2013.01); B64D 2013/0614 (2013.01); F05D 2220/40 (2013.01); F05D 2230/30 (2013.01); F05D 2230/31 (2013.01); F05D 2240/55 (2013.01);
Abstract
An additively manufactured component includes an outer shell, the outer shell enclosing a space therein. An inner lattice structure is in the space of the outer shell. Interspaces are formed in the inner lattice structure. A method of forming an additively manufactured component includes evacuating a chamber in which the additively manufactured component will be formed, and forming in the chamber layer by layer an outer shell enclosing a core. The core includes a lattice structure with interspaces formed in the lattice structure.