The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 12, 2025

Filed:

Nov. 10, 2020
Applicant:

Dyson Technology Limited, Wiltshire, GB;

Inventors:

Michael Edward Rendall, Newbury, GB;

Robert Ian Joseph Gruar, Swindon, GB;

Assignee:

Dyson Technology Limited, Wiltshire, GB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/52 (2006.01); C23C 16/455 (2006.01);
U.S. Cl.
CPC ...
C23C 16/52 (2013.01); C23C 16/45536 (2013.01);
Abstract

An apparatus for sputter deposition of target material to a substrate is disclosed. In one form, the apparatus includes a substrate portion in which a substrate is provided and a target portion in which target material is provided, in use. The target portion and the substrate portion define between them a deposition zone. The apparatus includes an antenna arrangement for generating plasma, in use, and a confining arrangement. The confining arrangement includes a first element between the antenna arrangement and the deposition zone and a second element. The antenna arrangement is between the second element and the deposition zone. The first element confines the plasma towards the deposition zone to provide for sputter deposition of target material to the substrate, in use. The second element confines the plasma away from the second element, towards the antenna arrangement and, via the first element, towards the deposition zone, in use.


Find Patent Forward Citations

Quick Actions:

Rendall, Michael. (2025). Method and apparatus for sputter deposition of target material to a substrate (U.S. Patent No. 12385141). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12385141

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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