The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 12, 2025

Filed:

Aug. 28, 2020
Applicant:

Nippon Steel Corporation, Tokyo, JP;

Inventors:

Takuya Mitsunobu, Tokyo, JP;

Kohei Tokuda, Tokyo, JP;

Takehiro Takahashi, Tokyo, JP;

Hiroshi Takebayashi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 18/00 (2006.01); B32B 15/01 (2006.01); B32B 15/04 (2006.01); B32B 15/18 (2006.01); C22C 18/04 (2006.01); C22C 21/00 (2006.01); C22C 21/06 (2006.01); C22C 21/10 (2006.01); C22C 30/00 (2006.01); C22C 30/02 (2006.01); C22C 30/06 (2006.01); C22C 38/00 (2006.01); C22C 38/06 (2006.01); C23C 2/06 (2006.01); C23C 2/12 (2006.01); C23C 2/20 (2006.01); C23C 2/26 (2006.01); C23C 2/28 (2006.01); C23C 2/40 (2006.01); C23C 22/07 (2006.01); C23C 22/12 (2006.01); C23C 22/83 (2006.01); C23C 28/00 (2006.01); C23C 30/00 (2006.01); C25D 11/36 (2006.01); C25D 13/20 (2006.01); C21D 1/18 (2006.01); C21D 1/673 (2006.01); C21D 7/13 (2006.01); C21D 8/02 (2006.01); C21D 9/46 (2006.01); C22C 38/04 (2006.01); C25D 13/22 (2006.01);
U.S. Cl.
CPC ...
C22C 18/00 (2013.01); B32B 15/012 (2013.01); B32B 15/013 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/18 (2013.01); C22C 18/04 (2013.01); C22C 21/00 (2013.01); C22C 21/06 (2013.01); C22C 21/10 (2013.01); C22C 30/00 (2013.01); C22C 30/02 (2013.01); C22C 30/06 (2013.01); C22C 38/002 (2013.01); C22C 38/06 (2013.01); C23C 2/06 (2013.01); C23C 2/12 (2013.01); C23C 2/20 (2013.01); C23C 2/26 (2013.01); C23C 2/261 (2022.08); C23C 2/28 (2013.01); C23C 2/29 (2022.08); C23C 2/40 (2013.01); C23C 22/07 (2013.01); C23C 22/12 (2013.01); C23C 22/83 (2013.01); C23C 28/00 (2013.01); C23C 28/30 (2013.01); C23C 28/321 (2013.01); C23C 28/3225 (2013.01); C23C 28/34 (2013.01); C23C 28/345 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); C25D 11/36 (2013.01); C25D 13/20 (2013.01); C21D 1/18 (2013.01); C21D 1/673 (2013.01); C21D 7/13 (2013.01); C21D 8/0247 (2013.01); C21D 8/0257 (2013.01); C21D 8/0278 (2013.01); C21D 9/46 (2013.01); C22C 38/00 (2013.01); C22C 38/04 (2013.01); C25D 13/22 (2013.01); Y10T 428/12597 (2015.01); Y10T 428/12604 (2015.01); Y10T 428/12611 (2015.01); Y10T 428/1266 (2015.01); Y10T 428/12667 (2015.01); Y10T 428/12729 (2015.01); Y10T 428/12757 (2015.01); Y10T 428/12799 (2015.01); Y10T 428/12958 (2015.01); Y10T 428/12972 (2015.01); Y10T 428/12979 (2015.01); Y10T 428/27 (2015.01);
Abstract

A hot stamped steel includes a base material that is formed of steel, a plated layer that is formed on a surface of the base material, and a phosphate coating that is formed on a surface of the plated layer; chemical composition of the plated layer contains 20.00 to 45.00 mass % of Al, 10.00 to 45.00 mass % of Fe, 4.50 to 15.00 mass % of Mg, 0.10 to 3.00 mass % of Si, 0.05 to 3.00 mass % of Ca, and the plated layer may further contain one or more of Sb, Pb, Cu, Sn, Ti, Sr, Cr, Ni, and Mn with a remainder of Zn and impurities; the phosphate coating comprises zinc phosphate crystals containing 5.0 to 50.0 mass % of Mg and 0.5 to 5.0 mass % of Ca; and the adhesion amount of the phosphate coating per one surface is in a range of 0.1 to 10.0 g/m.


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