The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 12, 2025

Filed:

Mar. 18, 2020
Applicant:

Dow Toray Co., Ltd., Tokyo, JP;

Inventors:

Ryosuke Yamazaki, Ichihara, JP;

Kouichi Ozaki, Ichihara, JP;

Toru Imaizumi, Ichihara, JP;

Masayuki Hayashi, Ichihara, JP;

Assignee:

DOW TORAY CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/35 (2018.01); B29C 45/00 (2006.01); C08L 83/04 (2006.01); C09J 183/04 (2006.01); B29K 83/00 (2006.01); H10H 20/851 (2025.01); H10H 20/854 (2025.01);
U.S. Cl.
CPC ...
C09J 7/35 (2018.01); B29C 45/0001 (2013.01); C08L 83/04 (2013.01); C09J 183/04 (2013.01); B29K 2083/00 (2013.01); C08L 2205/025 (2013.01); C09J 2483/00 (2013.01); H10H 20/851 (2025.01); H10H 20/854 (2025.01);
Abstract

Provided is a curable silicone composition and applications thereof. The curable silicone composition has hot-melt properties, excellent workability, and curing characteristics such as overmolding, and a cured product obtained therefrom does not become hard or brittle, even if left at a temperature of 150° C. or higher for a long time. The curable silicone composition comprises: an organopolysiloxane resin component which is non-hot-meltable, comprises a siloxane unit represented by SiOmaking up at least 20 mol % or more of the total siloxane units, and has a mass loss of 2.0 mass % or less when exposed to 200° C. for 1 hour; a liquid straight-chain or branched chain organopolysiloxane; and a curing agent.


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