The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 12, 2025

Filed:

Jul. 13, 2023
Applicant:

3d Systems, Inc., Rock Hill, SC (US);

Inventors:

Monica Keilsohn, San Diego, CA (US);

Michael Brady, San Diego, CA (US);

Khalil Moussa, Chapel Hill, NC (US);

Assignee:

3D Systems, Inc., Rock Hill, SC (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09D 151/08 (2006.01); A61L 27/16 (2006.01); A61L 27/52 (2006.01); B29C 64/124 (2017.01); B29K 33/00 (2006.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); C08F 290/06 (2006.01); C09D 4/00 (2006.01); C09D 7/41 (2018.01);
U.S. Cl.
CPC ...
C09D 151/08 (2013.01); A61L 27/16 (2013.01); A61L 27/52 (2013.01); B33Y 70/00 (2014.12); C08F 290/062 (2013.01); C09D 4/00 (2013.01); C09D 7/41 (2018.01); A61L 2300/442 (2013.01); B29C 64/124 (2017.08); B29K 2033/08 (2013.01); B33Y 10/00 (2014.12);
Abstract

In one aspect, build materials for use with a three-dimensional (3D) printing system are described herein. In some embodiments, a build material described herein comprises an acrylate component, a photoinitiator component, a non-curable absorber component, and water. The photoinitiator component of the build material is operable to initiate curing of the acrylate component and/or other curable materials that may optionally be present when the photoinitiator is exposed to incident curing radiation having a Gaussian distribution of wavelengths and a peak wavelength λ. The build material has a penetration depth (D) and a critical energy (E) at the wavelength λ. In some embodiments, the Dis greater than 200 μm and less than 300 μm, and the Eis 3-12 mJ/cm. In other embodiments, the Dis greater than 10 μm and less than 50 μm, and the Eis 5-40 mJ/cm.


Find Patent Forward Citations

Loading…