The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 12, 2025

Filed:

Feb. 24, 2021
Applicant:

Mitsubishi Gas Chemical Company, Inc, Tokyo, JP;

Inventors:

Takashi Kobayashi, Tokyo, JP;

Kazuhiro Hashiguchi, Tokyo, JP;

Keiichi Hasebe, Tokyo, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08L 71/12 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); C08J 5/24 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08L 71/126 (2013.01); C08J 5/244 (2021.05); H05K 1/0346 (2013.01); B32B 5/024 (2013.01); B32B 5/263 (2021.05); B32B 15/14 (2013.01); B32B 15/20 (2013.01); B32B 2250/40 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2307/202 (2013.01); B32B 2307/204 (2013.01); B32B 2307/206 (2013.01); B32B 2307/714 (2013.01); B32B 2307/7265 (2013.01); B32B 2457/08 (2013.01); C08J 2371/12 (2013.01); C08J 2479/08 (2013.01);
Abstract

Provided is a resin composition having excellent low water absorption, as well as a cured product, a prepreg, a metal foil-clad laminate, a resin sheet, and a printed wiring board. The resin composition contains a compound (A) represented by Formula (M1) and a compound (B) containing two or more unsaturated carbon-carbon double bonds, and in Formula (M1), A is a four- to six-membered alicyclic group:


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