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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12384913 B1

PDFFull Text
Date of Patent:
Aug. 12, 2025

Filed:

Jun. 21, 2021

Thermoplastic resin composition and molded article manufactured using the same

Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Eun Jung Choi, Daejeon, KR;

Seo Hwa Kim, Daejeon, KR;

Byoung Il Kang, Daejeon, KR;

Seongkyun Kim, Daejeon, KR;

Yeongmin Kim, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:

Morgan, Lewis & Bockius LLP

Primary Examiner:

Mark S Kaucher

Int. Cl.
CPC ...
C08L 55/02 (2006.01); C08F 220/18 (2006.01); C08L 23/0853 (2025.01); C08L 25/12 (2006.01); C08L 51/00 (2006.01); C08L 77/12 (2006.01);
U.S. Cl.
CPC ...
C08L 55/02 (2013.01); C08F 220/1804 (2020.02); C08F 220/1806 (2020.02); C08F 220/1808 (2020.02); C08L 23/0853 (2013.01); C08L 25/12 (2013.01); C08L 51/003 (2013.01); C08L 77/12 (2013.01); C08L 2203/30 (2013.01); C08L 2205/025 (2013.01); C08L 2205/035 (2013.01); C08L 2207/04 (2013.01); C08L 2207/53 (2013.01);
Abstract

Disclosed is a thermoplastic resin composition having excellent compatibility between a base resin and additives that may prevent aggregation of a metal pigment, and a molded article including the same. Also disclosed is a molded article manufactured using the thermoplastic resin composition, which may reduce flow marks on a metallic surface, and thus appearance and gloss may be excellent, injection quality and antistatic properties may be excellent, and the molded article may be widely used in various fields such as electronics.

Find Patent Forward Citations

Choi, Eun. (2025). Thermoplastic resin composition and molded article manufactured using the same (U.S. Patent No. 12384913). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12384913

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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