The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2025
Filed:
Sep. 20, 2019
Applicant:
Ppg Industries Ohio, Inc., Cleveland, OH (US);
Inventors:
Allison G. Condie, Valencia, PA (US);
Masayuki Nakajima, Wexford, PA (US);
Kar Tean Tan, Wexford, PA (US);
Peter L. Votruba-Drzal, Pittsburgh, PA (US);
Maria S. French, Maidenhead, GB;
Hongying Zhou, Allison Park, PA (US);
Baptiste Rayer, Ribecourt-Dreslincourt, FR;
Assignee:
PPG Industries Ohio, Inc., Cleveland, OH (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 63/664 (2006.01); B29C 64/118 (2017.01); B29K 63/00 (2006.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); C08G 59/06 (2006.01); C08G 59/56 (2006.01); C08G 59/66 (2006.01); C08G 63/78 (2006.01); C08L 63/00 (2006.01); C08L 81/02 (2006.01); C09D 7/63 (2018.01); C09D 163/00 (2006.01); C09D 167/04 (2006.01); C09J 11/06 (2006.01); C09J 163/00 (2006.01); C09J 167/04 (2006.01); G10K 11/162 (2006.01);
U.S. Cl.
CPC ...
C08G 63/664 (2013.01); B33Y 70/00 (2014.12); C08G 59/066 (2013.01); C08G 59/56 (2013.01); C08G 59/66 (2013.01); C08G 63/78 (2013.01); C08L 63/00 (2013.01); C08L 81/02 (2013.01); C09D 7/63 (2018.01); C09D 163/00 (2013.01); C09D 167/04 (2013.01); C09J 11/06 (2013.01); C09J 163/00 (2013.01); C09J 167/04 (2013.01); G10K 11/162 (2013.01); B29C 64/118 (2017.08); B29K 2063/00 (2013.01); B29K 2995/0002 (2013.01); B33Y 10/00 (2014.12); C08L 2205/035 (2013.01);
Abstract
The present invention is directed toward a composition comprising: an epoxy compound, a polythiol curing agent, and a second curing agent. Also disclosed are methods of treating a substrate with the composition and substrates formed by such methods.