The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 12, 2025

Filed:

Nov. 28, 2019
Applicant:

Delo Industrie Klebstoffe Gmbh & Co. Kgaa, Windach, DE;

Inventors:

Gerald Uhl, Windach, DE;

Timo Anselment, Windach, DE;

Michael Scholz, Windach, DE;

Sebastian Zink, Windach, DE;

Kilian Kreul, Windach, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/24 (2006.01); B29C 35/08 (2006.01); B32B 38/00 (2006.01); C08G 59/40 (2006.01); C08G 59/62 (2006.01); C09D 4/00 (2006.01); C09D 163/00 (2006.01); C09J 163/00 (2006.01); C09K 3/10 (2006.01);
U.S. Cl.
CPC ...
C08G 59/24 (2013.01); C08G 59/4007 (2013.01); C08G 59/62 (2013.01); C09D 4/00 (2013.01); C09D 163/00 (2013.01); C09J 163/00 (2013.01); C09K 3/10 (2013.01); B29C 2035/0833 (2013.01); B32B 2038/0076 (2013.01); C09K 2200/0647 (2013.01);
Abstract

The invention relates to a cationically curable composition with at least one cationically polymerizable component, a first photoinitiator releasing an acid when irradiated with actinic radiation of a first wavelength λ, and a second photoinitiator releasing an acid when irradiated with actinic radiation of a second wavelength λ, wherein the second wavelength λis shorter than the first wavelength λ, and wherein the second photoinitiator, after irradiation of the composition with actinic radiation of the first wavelength λ, shows an absorption of actinic radiation of the second wavelength λin the composition that is sufficient to activate the second photoinitiator and fix the composition. Furthermore, a method is described for the joining, casting, molding, sealing and/or coating of substrates using the cationically curable composition.


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