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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12384862 B1

PDFFull Text
Date of Patent:
Aug. 12, 2025

Filed:

Jan. 24, 2023

Resin composition, resin film using same, metal foil with resin, metal-clad laminate, and wiring board

Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Tomohiro Fukao, Osaka, JP;

Tomoaki Sawada, Osaka, JP;

Kyosuke Michigami, Hyogo, JP;

Assignee:

PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka, JP;

Attorney:

GREENBLUM & BERNSTEIN, P.L.C.

Primary Examiner:

Arrie L Reuther

Assistant Examiner:

David R Foss

Int. Cl.
CPC ...
C08F 220/32 (2006.01); B32B 15/082 (2006.01); B32B 15/20 (2006.01); C08F 20/32 (2006.01); C08F 20/42 (2006.01); C08F 20/44 (2006.01); C08F 220/18 (2006.01); C08F 220/44 (2006.01); C08J 5/18 (2006.01); C08K 5/09 (2006.01);
U.S. Cl.
CPC ...
C08F 220/325 (2020.02); B32B 15/082 (2013.01); B32B 15/20 (2013.01); C08F 220/1811 (2020.02); C08F 220/44 (2013.01); C08J 5/18 (2013.01); C08K 5/09 (2013.01); B32B 2307/304 (2013.01); B32B 2311/12 (2013.01); B32B 2457/08 (2013.01); C08F 20/32 (2013.01); C08F 20/42 (2013.01); C08F 20/44 (2013.01); C08J 2333/08 (2013.01); C08J 2333/20 (2013.01);
Abstract

An aspect of the present invention relates to a resin composition containing an acrylic resin and a curing agent, in which the acrylic resin contains a polymerization unit (A) of a (meth)acrylate having an epoxy group, a polymerization unit (B) of a (meth)acrylate having a cyano group, and a polymerization unit (C) of a (meth)acrylate having an isobornyl group, a weight average molecular weight of the acrylic resin is 50,000 or more and 3,000,000 or less, and a storage modulus of a cured product of the resin composition at 200° C. is 0.1 MPa or more and 3.5 MPa or less.

Find Patent Forward Citations

Fukao, Tomohiro. (2025). Resin composition, resin film using same, metal foil with resin, metal-clad laminate, and wiring board (U.S. Patent No. 12384862). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12384862

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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