The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 12, 2025

Filed:

Jul. 01, 2022
Applicant:

Elite Buffer Llc, Garden Grove, CA (US);

Inventor:

Jeff Chen, Irvine, CA (US);

Assignee:

Elite Buffer LLC, Garden Grove, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B60G 11/22 (2006.01); B60G 11/54 (2006.01); F16F 3/093 (2006.01);
U.S. Cl.
CPC ...
B60G 11/22 (2013.01); B60G 11/54 (2013.01); F16F 3/093 (2013.01); B60G 2202/143 (2013.01); B60G 2204/125 (2013.01); B60G 2204/4502 (2013.01); B60G 2206/42 (2013.01); B60G 2206/73 (2013.01); B60G 2800/162 (2013.01); F16F 2224/025 (2013.01); F16F 2230/32 (2013.01);
Abstract

A universal modular coil spring buffer having a plurality of modules arranged in a specific configuration adaptable to be inserted in the gap of a coil spring of a vehicle to prevent shocks. The plurality of modules includes a primary module and a plurality of secondary modules. The top surface and the bottom surface of the primary module includes an elongated groove configured to fix and hold the adjacent coils of the coil spring of the vehicle. The secondary module having a first module, a second module and a third module. The different configurations of the primary module and the plurality of secondary modules can be employed for different vehicles with different coil spring dimensions and based on the distance between the adjacent coils. The buffer lessens the compression to the coil spring thereby minimizing oil to leak caused from the shocks.


Find Patent Forward Citations

Chen, Jeff. (2025). Universal modularized coil spring buffer (U.S. Patent No. 12384211). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12384211

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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