The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 12, 2025

Filed:

Jun. 02, 2022
Applicant:

Sandvik Intellectual Property Ab, Sandviken, SE;

Inventors:

Carl-Johan Maderud, Stockholm, SE;

Johan Sundstrom, Lovstabruk, SE;

Magnus Ekelund, Jarna, SE;

Sven Englund, Linkoping, SE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 3/15 (2006.01); B22F 1/052 (2022.01); B22F 1/065 (2022.01); B22F 1/142 (2022.01); B22F 3/10 (2006.01); B22F 3/12 (2006.01); B22F 7/06 (2006.01); B22F 9/04 (2006.01); B22F 10/14 (2021.01); B22F 10/34 (2021.01); B28B 3/00 (2006.01); B33Y 10/00 (2015.01); B33Y 40/00 (2020.01); B33Y 40/10 (2020.01); B33Y 70/00 (2020.01); B33Y 70/10 (2020.01); C22C 29/02 (2006.01); C22C 29/08 (2006.01); C22C 29/10 (2006.01); C22C 29/16 (2006.01);
U.S. Cl.
CPC ...
B22F 3/15 (2013.01); B22F 1/065 (2022.01); B22F 1/142 (2022.01); B22F 3/1003 (2013.01); B22F 3/1021 (2013.01); B22F 3/1216 (2013.01); B22F 7/06 (2013.01); B22F 9/04 (2013.01); B22F 10/34 (2021.01); B28B 3/003 (2013.01); B33Y 10/00 (2014.12); B33Y 40/00 (2014.12); B33Y 40/10 (2020.01); B33Y 70/10 (2020.01); C22C 29/02 (2013.01); C22C 29/08 (2013.01); C22C 29/10 (2013.01); C22C 29/16 (2013.01); B22F 1/052 (2022.01); B22F 10/14 (2021.01); B22F 2301/15 (2013.01); B22F 2302/10 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); B33Y 70/00 (2014.12); Y02P 10/25 (2015.11);
Abstract

The present disclosure relates to a method of making a powder of dense and spherically shaped cemented carbide or cermet granules. The present disclosure also relates to a powder produced by the method and use of said powder in additive manufacturing such as 3D printing by the binder jetting technique. Furthermore, the present disclosure relates to a Hot Isostatic Pressing (HIP) process for manufacturing a product by using said powder.


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