The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2025

Filed:

Jun. 05, 2019
Applicant:

Suzhou Lekin Semiconductor Co., Ltd., Taicang, CN;

Inventor:

Koh Eun Lee, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10H 20/858 (2025.01); H10F 77/00 (2025.01); H10F 77/123 (2025.01); H10F 77/124 (2025.01); H10F 77/20 (2025.01); H10F 77/30 (2025.01); H10F 77/60 (2025.01); H10H 20/823 (2025.01); H10H 20/825 (2025.01); H10H 20/831 (2025.01); H10H 20/84 (2025.01); H10H 20/857 (2025.01);
U.S. Cl.
CPC ...
H10H 20/8581 (2025.01); H10F 77/123 (2025.01); H10F 77/1246 (2025.01); H10F 77/206 (2025.01); H10F 77/306 (2025.01); H10F 77/60 (2025.01); H10F 77/933 (2025.01); H10H 20/823 (2025.01); H10H 20/825 (2025.01); H10H 20/8312 (2025.01); H10H 20/84 (2025.01); H10H 20/857 (2025.01); H10H 20/8583 (2025.01);
Abstract

An embodiment provides a semiconductor device package, the semiconductor device package comprising: a substrate including an electrode disposed on one surface; a metal sidewall disposed on the substrate while surrounding the electrode; a semiconductor device disposed on the electrode; and a light transmitting member disposed on the metal sidewall to cover the semiconductor device, wherein the metal sidewall has the inner surface and the outer surface which are corrugated, and includes: a first metal part disposed on the substrate; a second metal part disposed on the first metal part; and a third metal part disposed on the second metal part, and the inner surface or the outer surface of the metal sidewall includes a recess portion between the second metal part and the third metal part.


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