The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2025

Filed:

Nov. 30, 2022
Applicant:

Nichia Corporation, Anan, JP;

Inventor:

Kosuke Sato, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/857 (2025.01); H10H 20/01 (2025.01); H10H 20/831 (2025.01);
U.S. Cl.
CPC ...
H10H 20/857 (2025.01); H10H 20/01 (2025.01); H10H 20/8312 (2025.01); H10H 20/032 (2025.01); H10H 20/0364 (2025.01);
Abstract

A method for manufacturing a light-emitting module includes: providing a wiring substrate including: a base member having an upper surface, and a metal layer disposed on the upper surface of the base member; forming a resist layer on the wiring substrate such that the metal layer is exposed from the resist layer; disposing an intermediate body on the resist layer, the intermediate body comprising a light-emitting element and a covering layer; forming a bonding member; removing the resist layer and the covering layer; and forming a plating layer on a surface of the bonding member by plating, such that a portion of the plating layer is located between an electrode surface of the light-emitting element and the bonding member.


Find Patent Forward Citations

Loading…