The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2025

Filed:

Feb. 25, 2022
Applicants:

Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventors:

Shunsuke Asaba, Himeji Hyogo, JP;

Hiroshi Kono, Himeji Hyogo, JP;

Makoto Mizukami, Ibo Hyogo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 84/00 (2025.01); H10D 62/10 (2025.01); H10D 62/17 (2025.01); H10D 62/832 (2025.01);
U.S. Cl.
CPC ...
H10D 84/146 (2025.01); H10D 62/109 (2025.01); H10D 62/393 (2025.01); H10D 62/8325 (2025.01);
Abstract

A semiconductor device of embodiments includes: a first silicon carbide region of first conductive type including a first region in contact with a first face of a silicon carbide layer having first and second faces; a second silicon carbide region of second conductive type above the first silicon carbide region; a third silicon carbide region of second conductive type above the second silicon carbide region; a fourth silicon carbide region of first conductive type above the second silicon carbide region; a first gate electrode and a second gate electrode extending in the first direction; a first electrode on the first face and including a first portion and a second portion between the first and the second gate electrode. The first portion contacts the third and the fourth silicon carbide region. The second portion provided in the first direction of the first portion and contacts with the first region.


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