The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2025

Filed:

Nov. 24, 2022
Applicant:

Auo Corporation, Hsinchu, TW;

Inventor:

Chen-Shuo Huang, Hsinchu, TW;

Assignee:

AUO Corporation, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 64/27 (2025.01); H10D 30/67 (2025.01); H10D 64/01 (2025.01);
U.S. Cl.
CPC ...
H10D 64/516 (2025.01); H10D 30/6733 (2025.01); H10D 30/6755 (2025.01); H10D 64/01 (2025.01);
Abstract

A semiconductor device and a manufacturing method of the semiconductor device are provided. The semiconductor device includes a substrate, a semiconductor structure, a gate dielectric layer, and a first gate. The semiconductor structure is disposed above the substrate and includes two thick portions and a thin portion located between the two thick portions. A thickness of the two thick portions is larger than a thickness of the thin portion. The gate dielectric layer is disposed on the semiconductor structure. The first gate is disposed on the gate dielectric layer. A width of the first gate is smaller or equal to a width of the thin portion, and the first gate is overlapped with the thin portion in a normal direction of a top surface of the substrate. A doping concentration of the two portions is larger than a doping concentration of the thin portion.


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