The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2025

Filed:

Mar. 03, 2021
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventors:

Masayoshi Tagami, Kuwana Mie, JP;

Katsuyuki Kitamoto, Yokkaichi Mie, JP;

Ken Komiya, Nagoya Aichi, JP;

Assignee:

KIOXIA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 64/23 (2025.01); H01L 23/00 (2006.01); H01L 25/18 (2023.01); H10B 43/10 (2023.01); H10B 43/27 (2023.01); H10B 43/35 (2023.01); H10D 30/69 (2025.01); H10D 64/01 (2025.01);
U.S. Cl.
CPC ...
H10D 64/258 (2025.01); H01L 24/82 (2013.01); H01L 25/18 (2013.01); H10B 43/10 (2023.02); H10B 43/27 (2023.02); H10B 43/35 (2023.02); H10D 30/696 (2025.01); H10D 64/037 (2025.01); H01L 2224/8234 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1438 (2013.01);
Abstract

A semiconductor device includes: a plurality of first electrode films stacked in a state of being insulated from each other; a plurality of semiconductor members extending in a stacked direction of the plurality of first electrode films in a stacked body of the plurality of first electrode films; a plurality of charge storage members provided between the plurality of first electrode films and the plurality of semiconductor members; a first conductive film having a first surface, and commonly connected to the plurality of semiconductor members on the first surface; a first insulating film provided on a second surface of the first conductive film on the side opposite to the first surface; a contact provided in the first insulating film and connected to the first conductive film; and a second conductive film provided on the first insulating film and connected to the contact.


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