The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2025

Filed:

Aug. 08, 2023
Applicant:

Leica Geosystems Ag, Heerbrugg, CH;

Inventors:

Ralph Harti, Winterthur, CH;

Stefan Kohlgrüber, Feldkirch, AT;

Andrey Marinov, Rorschach, CH;

Michele Portentoso, Schachen bei Reute, CH;

Assignee:

LEICA GEOSYSTEMS AG, Heerbrugg, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); G01S 17/894 (2020.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); G01S 17/894 (2020.01); H05K 1/0274 (2013.01); H05K 2201/10121 (2013.01);
Abstract

A printed circuit board (PCB) having a lateral extent and comprising a side landing pad for direct bonding of an optoelectronic chip, whereby the side landing pad comprises at least two landing areas being differently oriented with regard to the lateral, thus enabling a bonding of the chip in at least two different lateral orientations relative to the printed circuit board, whereby the electrical connection lengths of the landing areas are equal, and an optoelectronic module based on such a printed circuit board and an according time of flight camera.


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