The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2025

Filed:

May. 10, 2022
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Yuan Yao, Tarrytown, NY (US);

Todd Edward Takken, Brewster, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01F 17/00 (2006.01); H01F 27/255 (2006.01); H01F 27/28 (2006.01); H05K 1/16 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H01F 17/0013 (2013.01); H01F 27/255 (2013.01); H01F 27/2804 (2013.01); H05K 1/165 (2013.01); H05K 3/429 (2013.01); H01F 2027/2809 (2013.01); H05K 2201/086 (2013.01);
Abstract

A circuit board including: a first board material layer having a first planar surface and a first sidewall surface perpendicular to the first planar surface; a first conductive layer on the first planar surface; a second board material layer stacked on the first board material layer and having a second planar surface and a second sidewall surface perpendicular to the second planar surface; a second conductive layer on the second planar surface; and a plating on the first sidewall surface and the second sidewall surface and electrically connecting the first conductive layer and the second conductive layer.


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