The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2025
Filed:
May. 17, 2022
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Jung Han Kim, Suwon-si, KR;
Youn Gyu Han, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A printed circuit board includes: a plurality of insulating layers; a plurality of wiring pattern layers disposed on at least one surface of the plurality of insulating layers; a via connecting wiring pattern layers, among the plurality of wiring pattern layers, disposed on upper and lower surfaces of one of the plurality of insulating layers to each other; a connection pad disposed on a surface of an outermost layer among the plurality of insulating layers; and a solder resist having a hole exposing at least a portion of the connection pad. An external surface of the solder resist has surface roughness.