The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2025

Filed:

Sep. 13, 2022
Applicant:

Suzhou Thor Electronic Technology Co., Ltd., Jiangsu, CN;

Inventors:

Hongbin Cao, Jiangsu, CN;

Jialong Shen, Jiangsu, CN;

Juan Chen, Jiangsu, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/10 (2006.01); H04R 1/02 (2006.01); H04R 9/02 (2006.01); H04R 31/00 (2006.01);
U.S. Cl.
CPC ...
H04R 1/1091 (2013.01); H04R 1/02 (2013.01); H04R 9/025 (2013.01); H04R 31/00 (2013.01); H04R 2460/13 (2013.01);
Abstract

The application discloses a bone conduction acoustic device, a method for assembling bone conduction acoustic device and a bone conduction earphone. The bone conduction acoustic device includes: a case, which includes a base case portion and a side case portion connected with the base case portion, a cavity with an opening at one end is formed between the base case portion and the side case portion; a cover connected to the side case portion and sealing the opening; the magnet assembly connected to the cover and located in the cavity; a voice coil assembly arranged in the cavity, and voice coil assembly part is arranged opposite to the magnet assembly part for driving the magnetic assembly to vibrate; and a circuit board arranged in the cavity and electrically connected to the voice coil assembly, the circuit board is located between the base case portion and the voice coil assembly. When the bone conduction acoustic device of the present application is installed, it is only necessary to install the circuit board and the voice coil assembly in the housing first, and then install the cover connected with the magnet assembly to the housing to complete the installation. The overall structure is simpler and more compact, and the assembly is more convenient.


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Cao, Hongbin. (2025). Bone conduction acoustic device, method for assembling bone conduction acoustic device and bone conduction earphone (U.S. Patent No. 12382212). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12382212

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