The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2025
Filed:
Mar. 31, 2021
Applicant:
Skyworks Global Pte. Ltd., Singapore, SG;
Inventors:
Kwang Jae Shin, Yongin, KR;
Jiansong Liu, Irvine, CA (US);
Jong Duk Han, Yongin, KR;
Jae Hyung Lee, Seoul, KR;
Yiliu Wang, Irvine, CA (US);
Yosuke Hamaoka, Suita, JP;
Alexandre Augusto Shirakawa, San Diego, CA (US);
Benfeng Zhang, Moriguchi, JP;
Assignee:
Skyworks Global Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 3/04 (2006.01); H03H 3/02 (2006.01); H03H 9/02 (2006.01); H03H 9/17 (2006.01); H03H 9/205 (2006.01); H03H 9/54 (2006.01); H03H 9/56 (2006.01); H04B 1/40 (2015.01);
U.S. Cl.
CPC ...
H03H 3/04 (2013.01); H03H 3/02 (2013.01); H03H 9/02015 (2013.01); H03H 9/02086 (2013.01); H03H 9/173 (2013.01); H03H 9/175 (2013.01); H03H 9/205 (2013.01); H03H 9/54 (2013.01); H03H 9/564 (2013.01); H03H 9/568 (2013.01); H04B 1/40 (2013.01); H03H 2003/0442 (2013.01);
Abstract
Methods of manufacturing bulk acoustic wave resonators are disclosed. During a common processing step, a first patterned mass loading layer for a first bulk acoustic wave resonator is formed and a second patterned mass loading layer for a second bulk acoustic wave resonator is formed. The first patterned mass loading layer has a different density than the second patterned mass loading layer.