The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2025

Filed:

Aug. 26, 2022
Applicant:

Hewlett Packard Enterprise Development Lp, Houston, TX (US);

Inventors:

Vance Brey Murakami, Los Gatos, CA (US);

Paul Wesley Stelter, San Bruno, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/73 (2011.01); H01R 12/70 (2011.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H01R 12/732 (2013.01); H01R 12/7082 (2013.01); H05K 1/144 (2013.01);
Abstract

A bracket for a printed circuit board assembly (PCA) may comprise a first portion configured to be coupled to a first face of a first printed circuit board (PCB) and a second portion configured to be coupled to a first face of a second PCB. In an assembled state of the PCA, the first and second PCBs are in a stacked arrangement with the respective first faces thereof facing in a first direction. Moreover, in the assembled state, the bracket controls a distance between the respective first faces of the first and second PCBs along the first direction independent of respective thicknesses of the first and second PCBs along the first direction.


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