The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2025

Filed:

Mar. 03, 2022
Applicant:

Nanya Technology Corporation, New Taipei, TW;

Inventor:

Tse-Yao Huang, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 21/76802 (2013.01); H01L 21/76837 (2013.01); H01L 23/5226 (2013.01); H01L 21/76885 (2013.01); H01L 23/53295 (2013.01); H01L 2223/54426 (2013.01);
Abstract

The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a first tier structure positioned on a substrate and including: a plurality of conductive features of the first tier structure positioned over the substrate, and a decoupling unit of the first tier structure positioned between the plurality of conductive features of the first tier structure, and including a bottle-shaped cross-sectional profile; a first set of solid alignment marks including: a first-tier-alignment mark of the first set of solid alignment marks positioned on the decoupling unit of the first tier structure; a first set of spaced alignment marks including: a first-tier-alignment mark of the first set of spaced alignment marks positioned in a mirror manner of the first-tier-alignment mark of the first set of solid alignment marks according to a first axis of symmetry.


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