The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2025

Filed:

Aug. 02, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Hyeonjeong Hwang, Cheonan-si, KR;

Dongkyu Kim, Anyang-si, KR;

Kyoung Lim Suk, Suwon-si, KR;

Wonjae Lee, Yongin-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 25/0652 (2013.01); H01L 23/49816 (2013.01); H01L 23/49833 (2013.01); H01L 23/5385 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/0235 (2013.01); H01L 2224/02351 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1437 (2013.01); H01L 2924/1438 (2013.01); H01L 2924/1443 (2013.01); H01L 2924/182 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/35121 (2013.01);
Abstract

A redistribution substrate may include a first interconnection layer having a first insulating pattern, a first dummy pattern and a second dummy pattern, the first and second dummy patterns being in the first insulating pattern, and a second interconnection layer stacked on the first interconnection layer, the second interconnection layer having a second insulating pattern, a signal pattern and a power/ground pattern, the signal and power/ground patterns being in the second insulating pattern. The first dummy pattern may be located below the signal pattern, and the second dummy pattern may be located below the power/ground pattern. The first dummy pattern may include dot patterns, and the second dummy pattern may include a plate pattern.


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