The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2025
Filed:
Feb. 22, 2022
Texas Instruments Incorporated, Dallas, TX (US);
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Abstract
An electronic device with a multilevel package substrate having multiple levels including a first level having conductive leads and a final level having conductive landing areas along a side, as well as a die mounted to the multilevel package substrate and having conductive terminals electrically coupled to respective ones of the conductive leads, and a package structure that encloses the die and a portion of the multilevel package substrate, where the multilevel package substrate has a conductive elevated trace layer with a confinement feature that extends outward from the side of the final level along a third direction that is orthogonal to the first and second directions, the confinement feature having a sidewall configured to laterally confine one of a solder, an adhesive, a side of a passive component, and a side of the die.