The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2025

Filed:

Mar. 22, 2021
Applicant:

Ampleon Netherlands B.v., Nijmegen, NL;

Inventors:

Jurgen Raben, Nijmegen, NL;

Mariano Ercoli, Nijmegen, NL;

Assignee:

Ampleon Netherlands B.V., Nijmegen, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01); H01L 23/055 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 23/49513 (2013.01); H01L 23/49555 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H05K 1/0204 (2013.01); H05K 1/021 (2013.01); H01L 23/055 (2013.01); H01L 23/3121 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/32221 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48101 (2013.01); H01L 2224/48175 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10757 (2013.01); H05K 2201/10818 (2013.01);
Abstract

Example embodiments relate to electronic packages and electronic devices that include the same. One embodiment includes an electronic package. The electronic package includes a package body. The electronic package also includes a heat-conducting substrate arranged inside the package body and having a bottom surface that is exposed to an outside of the package body. Additionally, the electronic package includes an electronic circuit arranged inside the package body and including a semiconductor die that has a bottom surface with which it is mounted to the heat-conducting substrate and an opposing upper surface. Further, the electronic package includes one or more leads partially extending from outside the package body to inside the package body and over the minimum bounding box, each lead having a first end that is arranged inside the package body. In addition, the electronic package includes one or more bondwires for connecting the first end(s) to the electronic circuit.


Find Patent Forward Citations

Loading…